Technical Program Committee

A-SSCC 2023 Technical Program Committee (TPC)

Technical Program Committee Chairs

Technical Program Chair

Ken Takeuchi, Univ.Tokyo

Technical Program Co-Chair

Pei-Yun Tsai, National Central University

Technical Program Vice-Chair

Tetsuya lizuka, Univ. Tokyo

Regular Technical Sub-Committee Chairs

Analog Circuits & Systems

Po-Chiun Huang, National Tsing Hua University

Data Converter

Kazuko Nishimura, Panasonic Corporation

Digital Circuits & Systems

Jun Zhou, University of Electronic Science and Technology of China

SoC & Signal Processing Systems

Joo-Young Kim, KAIST

Radio Frequency

Minoru Fujishima, Hiroshima University

Wireline

Byungsub Kim, POSTECH

Emerging Technologies and Applications

Jerald Yoo, National University of Singapore

Memory

Chiweon Yoon, Samsung Electronics

FPGA

Jun Deguchi, Kioxia Corporation

Special Sessions Chairs

Industry Program Chair

Stefan Rusu, TSMC North America

Educational Program Chair

Seung-Tak Ryu, KAIST

Invited Program Chair

Zhihua Wang, Tsinghua U.

Special Programs Chair

Makoto Takamiya, Univ. Tokyo

ACE Program Chair

Woogeun Rhee, Tsinghua U.

Demo Program Chair

Jung-Hoon Chun, Sungkyunkwan U.

Sai-Weng Sin, U. of Macao

Technical Program Committee Members

Analog Circuits and Systems

Chair

Po-Chiun Huang, National Tsing Hua University

Committee member

Po-Hung Chen, National Chiao Tung University

Hyun-Sik Kim, KAIST

Wanyuan Qu, Zhejiang University

Sai-Weng Sin, University of Macau

Makoto Takamiya, University of Tokyo

Taekwang Jang, ETH, Swiss

Pieter Harpe, Eindhoven University of Technology

Christoph Sandner, Infineon

Min-Jae Seo, Gachon University

Hirshi Fuketa, Nat. Inst. of Adv. Ind. Sci and Tech (AIST)

Sining Pan, Tsinghua University

Garg Paras STMicroelectronics

Data Converters

Chair

Kazuko Nishimura, Panasonic Corporation

Committee member

Chih-Cheng Hsieh, National Tsing Hua University

Qiang Li, University of Electronic Science and Technology of China (UESTC)

Yong Lim, Samsung Electronics

Seung-Tak Ryu, KAIST

Takashi Oshima, Hitachi

Shuang Zhu, NVDIA

Hsin-Shu Chen, National Taiwan University

Hayun Chung, Korea Univ.

Hyungil Chae, Konkuk university

Lu Jie, Tsinghua University

Chi-Hang Chan, Ivor, University of Macau

Zhichao Tan, Zhejiang University

Digital Circuits and Systems

Chair

Jun Zhou, University of Electronic Science and Technology of China

Committee member

Massimo Alioto, National University of Singapore

Mototsugu Hamada, University of Tokyo

Yoonmyung Lee, Sungkyunkwan University

Koyo Nitta, University of Aizu

Shouyi Yin, Tsinghua University

Xiaoyang Zeng, Fudan University

Robert Chen-Hao Chang, National Chung Hsing University

Shuou Nomura, Kioxia Corporation

Yongtae Kim, Kyungbook National University

Amit Agarwal, Intel

Yu-Guang Chen, National Central University

Fengwei An, Southern University of Science and Technology

SoC and Signal Processing Systems

Chair

Joo-Young Kim, KAIST

Committee member

Kazutami Arimoto, Okayama Prefectural Univ.

Kyuho Jason Lee, UNIST (Ulsan National Institute of Science and Technology)

Tsung-Te Liu, National Taiwan University

Daisuke Mizoguchi, Renesas

JunYoung Park, UX Factory

Pei-Yun Tsai, National Central University

Sachin Taneja, Intel

Leibo Liu, Tsinghua University

Kun-Chin Chen, National Yang Ming Chiao Tung University

Weiwei Shan, Southeast University

Wireless

Chair

Minoru Fujishima, Hiroshima University

Committee member

Baoyong Chi, Tsinghua University

Chien-Nan Kuo, National Chao Tung University

Minjae Lee, Gwangju Institute of Science and Technology

Giovanni Mangraviti, IMEC

Dixian Zhao, Southeast University

Jaehyouk Choi, Seoul National University

Kenichi Okada, Tokyo Institute of Technology

Mustafijur Rahman, Indian Institute of Technology Delhi

Kuang-Wei Cheng, National Cheng Kung University

Hao Gao, Eindhoven University of Technology

Yun Yin, Fudan University

Wireline Communications

Chair

Byungsub Kim, POSTECH

Committee member

Jung-Hoon Chun, Sungkyunkwan University

Tetsuya Iizuka, University of Tokyo

Peng Liu, Zhejiang University

Ziqiang Wang, Tsinghua University

Pen-Jui Peng, National Tsing Hua University

Yong Chen, University of Macau

Masum Hossain, U. of Alberta

Jihwan Kim, Intel

Huaide Wang, M31 Technology

Ilmin Yi, GIST

Takashi Toi, Kioxia

Nan Qi, Institute of Semiconductors, Chinese Academy of Science

Wei Deng Tsinghua University

Emerging Technologies and Applications

Chair

Jerald Yoo, National University of Singapore

Committee member

Ping-Hsuan Hsieh, National Tsing Hua University

Inhee Lee, University of Pittsburgh

Chao Wang, Huazhong University of Science and Technology

Joonsung Bae, Kangwon National University

Takuji Miki, Kobe University

Bo Zhao, Zhejiang University

Chihiro Okada, Sony Semiconductor Solutions Corporation

Kea-Tiong (Samuel) Tang, National Tsing-Hua Univ

Wanyeong Jung, KAIST

Jongwoo Lee, Samsung Electronics

Haikun Jia, Tsinghua University

Memory

Chair

Chiweon Yoon, Samsung Electronics

Committee member

Junghwan Choi, Samsung Electronics

Tony T. Kim, Nanyang Technological University

Jun Yang, Southeast University

JunYoung Song, Incheon National University

Atsushi Kawasumi, Kioxia

Jui-Jen Wu, TSMC

Ho-Yin Chen, Etron Technology Inc

Anh Tuan Do, Institute of Microelectronics

Akiko Kanda, Renesas

Chixiao Chen, Fudan University

FPGA

Chair

Jun Deguchi, Kioxia Corporation

Committee member

Hiromitsu Awano, Kyoto University

Ji-Hoon Kim, Ewha Womans University

Youngjoo Lee, POSTECH

Tay‐Jyi Lin, National Chung Cheng University

Yong-Pan Liu, Tsinghua University

Shigeki Tomishima, Intel

Atsutake Kosuge, The University of Tokyo

Jinshan Yue, Institute of Microelectronics of the Chinese Academy of Sciences

Industry

Chair

Stefan Rusu, TSMC North America

Committee member

Saki Hatta, NTT

Yi Kang, University of Science and Technology

Surhud Khare, Intel

Toru Shimizu, Toyo University

ShaoJun Wei, Tsinghua University

Ting Wu, Norel Systems

Ma Fan Yung, National University of Singapore

Takayuki Miyazaki Kioxia Corporation

Jinwook Oh Rebellions Inc.